论文标题:360° omnidirectional, printable and transparent photodetectors for flexible optoelectronics
期刊:npj Flexible Electronics
作者:Der-Hsien Lien, Hsin-Ping Wang, Shih-Bin Chen, Yu-Chieh Chi, Chung-Lun Wu, Gong-Ru Lin, Ying-Chih Liao, Jr-Hau He
发表时间:2018/06/08
数字识别码: 10.1038/s41528-018-0032-2
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光电子学在信息传递、能量采集、环境监测以及生物明升手机版等应用领域占据着重要的地位。为了将这些应用更好的融入人们的日常生活,改善下一代电子设备的可穿戴特性及移动系统,如发展柔性显示、可穿戴光子纺织品、自供电系统以及生物信号监测,便显得尤其必要。为了实现柔性光电子器件的可弯曲、包裹及拉伸特性,整个电子学系统,包括活动层、电极、电路等,都必须具备柔性及可延展性,以适用于人们的肢体运动,从而实现光电子学在可穿戴器件及移动设备领域的应用。
Jr-Hau He教授和合作者们在npj Flexible Electronics 发表了题为“360° omnidirectional, printable andtransparent photodetectors for flexible optoelectronics”的文章,展示了一种360度全方位透明光电探测器,可拉伸包裹在柔性基底周围。此设备经由喷墨印刷,将氧化锌及银纳米丝交错植入热塑性聚氨酯弹性体后,在透明区域具有超过75%的透明比,展现出了高光响应度与响应时间(分别是10-30A/W和0.8S)。此外,此柔性光电探测器能够较好的承受变形,可应用于卷曲的表面,如皮肤,光纤等。此研究将助力于柔性光电子学的发展,包括纤维光学、可穿戴电子、自供电系统、生物信号检测器以及表皮电子等方面的应用。
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摘要:Flexible optoelectronics that can be bent, wrapped, and stretched have attracted interest for wearable and mobile applications. In this work, we demonstrate a transparent 360° omnidirectional photodetector (PD) that can be stretched and wrapped around flexible or curved substrates. By embedding interlaced ZnO and Ag nanowires (NWs) in thermoplastic polyurethane via inkjet printing, the device featured > 75% transmittance in the visible region, showing high photoresponsivity and response time (10–30 A/W and 0.8 s, respectively). Moreover, the flexible PD performs well under deformation (only 9% decay in the photocurrent under 60% strain and 8% loss when the device is bent at a radius of 5 mm), which allows it to be readily applied on curved surfaces, such as skin or optical fibers. This study opens the door for the development of flexible optoelectronics that could be implemented in fiber optics, wearable electronics, self-powered systems, bio-signal monitors, and epidermal electronics.
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期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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