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北京时间2023年4月14日晚八点，iCANX Talks 第139期将在iCANX平台上线！本期我们邀请到清华大学冯雪教授进行分享！更多精彩，敬请期待！

【明升app官网直播介绍】

Xue Feng

Tsinghua University

Flexible integrated circuits: design, manufacture and applications

【Abstract】

Flexible electronics technology refers to the integration of different materials and functional units on flexible substrates to form thin, flexible, deformable and reconfigurable electronic devices/systems. It subversively changes the rigid physical form of traditional electronic devices. The core of flexible electronics technology is the design, manufacture and reliability of flexible integrated devices.

柔性电子技术是指将不同的材料和功能单元集成在柔性衬底上，形成轻薄柔小、可变形、可重构的电子器件/系统。它颠覆性地改变了传统电子器件刚性的物理形态。柔性电子技术的核心是柔性集成器件的设计、制造及可靠性。

This talk firstly introduces the design theory and manufacture of flexible integrated devices, including the evolution mechanism of semiconductor properties under deformation and the integration method of transfer printing on heterogeneous interfaces. For wafer level manufacturing of flexible integrated devices, nanometer diamond enhanced wafer grinding method is used, which can thin 4-12 inch wafer to 25 microns. With ultra-thin chips transfer and high energy laser beam slicing, the single flexible chips with independent function are obtained.

本次演讲首先介绍了柔性集成器件设计理论和方法，包括形变下半导体性能演化机理、异质界面转印集成方法等。针对柔性集成器件的晶圆级制造，采用了纳米金刚石强化晶圆研磨法，可将4～12英寸晶圆薄化到25微米，进行超薄晶圆转移和高能激光束划片，得到具有独立功能的单个柔性芯片。

Then the flexible chips are picked up, transferred, interconnected, encapsulated and integrated, and finally the flexible integrated devices are formed. The first small test line of flexible integrated device manufacturing domestic and abroad and the CNAS standard testing and certification system have been established, and ultra-thin flexible chips, high-density packaging of flexible chips, high-precision SMT of flexible circuit boards and low-temperature silicone injection encapsulation have been realized from chip level to module level manufacturing. The above technologies greatly promote the innovation and development of flexible integrated devices and their applications in health care, intelligent perception, major equipment and other fields.

随后进行柔性芯片拾取、转移、互连、封装和集成，最终形成柔性集成器件。建立了国际国内首条柔性集成器件制造小试线和CNAS标准检测认证体系，实现超薄柔性芯片、柔性芯片高密度封装、柔性电路板高精度SMT和低温硅胶注塑包封等从芯片级到模组级制造。以上技术极大推进了柔性集成器件的创新发展及其在健康医疗、智能感知、重大装备等领域的应用。

【BIOGRAPHY】

Xue Feng, male, born in 1977, Professor of Tsinghua University, 973 Project Chief Scientist, currently director of Flexible Electronic Technology Laboratory of Tsinghua University, President of Zhejiang Tsinghua Flexible Electronic Technology Research Institute, etc.

冯雪，男，1977年生，清华大学长聘教授，国家973首席app家、国家杰青等，现任清华大学柔性电子技术实验室主任、浙江清华柔性电子技术研究院院长等。

Professor Feng Xue is committed to solid mechanics and flexible electronics technology. So far, he has published more than 260 SCI papers in Nat. Mater., Sci. Adv., Adv Mater. More than 190 national invention patents and 9 software Copyrights were authorized. He has won the Heliang Heli Foundation Science and Technology Innovation Award, China Youth Science and Technology Award, National Outstanding Scientist of Science and Technology, Qiushi Outstanding Youth Award of China Association for Science and Technology, etc. Ranked in 1st, he has won the first prize of Beijing Natural Science, the first prize of Technology Invention of the Ministry of Education and many other awards.

冯雪教授致力于固体力学与柔性电子技术研究，至今在Nat. Mater.、Sci. Adv.、Adv. Mater.、Natl. Sci. Rev.、JMPS等已发表SCI论文260余篇；授权国家发明专利190余项、自主软件著作权9项；曾获何梁何利基金app与技术创新奖、明升中国青年科技奖、全国优秀科技工作者、明升中国科协求是杰出青年奖等，以第一完成人获北京市自然app一等奖、教育部技术发明一等奖等奖等多项省部级和学会奖励。